| 摘要 |
[PROBLEMS] To provide a resin composition that has a short semicrystallization time, and when molded into film, a film bears a high degree of surface crystallization and a small blocking coefficient. Further, to provide a release film having good releasability suitable for the production of a FPC, which is obtained by molding the resin composition. Further, to provide a mold for production of a sealed electronic element product having excellent heat resistance and releasibility, in which the mold is hard to deform even when repeatedly used in the production of a sealed electronic element product of an LED or the like, and to provide an LED mold. [MEANS FOR SOLVING PROBLEMS] The invention provides a poly 4-methyl-1-pentene resin composition which comprises a polymer containing 80% by mass or more of 4-methyl-1-pentene in which the resin composition has a melting point of 170 to 240°C and a semicrystallization time of 70 to 220 seconds, and a release film having good releasibility, a mold for production of a sealed electronic element product having excellent heat resistance and releasibility and an LED mold, which are obtained by molding the resin composition.
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