| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold assembly for sucking the gas in a cavity under vacuum without moving an ejector pin immediately before ejection. SOLUTION: The mold assembly 1 is constituted so that the ejector pin 42 is fixed to an ejector plate 41 while a center pin 46 is attached to the ejector plate so as to be retracted by a predetermined distance and on the center pin retreats when an ejector rod 50 is retracted. Further, the mold assembly 1 is constituted so that the air passing channel 61 communicating with a vacuum suction device 70 is provided to a part along the center pin to communicate with the cavity 30 only when the center pin is retracted. The cavity is sucked under vacuum when the ejector rod is retracted just before injection. COPYRIGHT: (C)2007,JPO&INPIT
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