发明名称 Wafer Transfer Pad
摘要 <p>A wafer transfer pad is provided to suppress loss of production by preventing a breakdown of a wafer to be transferred to a pad part. A shift part(10) is installed inside a pad part(2). A plurality of wafers(4) are loaded into a cassette plate. The shift part comes in contact with one side of the wafer of the cassette plates in an elevating state of the cassette plate. The shift part includes a first shift(12) having a projection(11), a second shift(14) connected with the first shift, and a third shift(16) shifted to a rotating direction of the second shift. A first rotary shaft is installed at a connective part between the first and the second shifts. A second rotary shaft(15) is installed at a connective part between the third and the second shifts.</p>
申请公布号 KR100696046(B1) 申请公布日期 2007.03.16
申请号 KR20050132611 申请日期 2005.12.28
申请人 发明人
分类号 H01L21/677 主分类号 H01L21/677
代理机构 代理人
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