| 摘要 |
A wiring board is provided, which is capable of bringing out the advantages of the structure where a plurality of semiconductor integrated circuit elements are mounted, and the wiring board which allows a reduction in size thereof and offers excellent cost performance and reliability. A wiring board 10 according to the present invention includes a substrate core 11, a ceramic capacitor 100, 101 and a built-up layer 31. The substrate core 11 has a housing opening portion 91 therein which opens at a core main surface 12. The ceramic capacitor 100, 101 is accommodated in the housing opening portion 91 in the state where the core main surface 12 and a capacitor main surface 102 are turned to the same side. The built-up layer 31 includes a semiconductor integrated circuit element mounting area 23, 24 in various locations on a surface 39 thereof. In the substrate core 11, each ceramic capacitor 100, 101 is disposed in an area corresponding to each semiconductor integrated circuit element mounting area 23, 24, respectively. |
