| 摘要 |
PROBLEM TO BE SOLVED: To provide a single-wafer processing cleaning apparatus which prevents an object to be processed from being contaminated by a cleaning liquid, and also to provide a method of manufacturing a plate product, by using the apparatus. SOLUTION: The single-wafer processing cleaning apparatus is provided with: a wafer cleaning tank 1 which cleans a semiconductor wafer (object to be processed) 6 placed on a wafer turning table 11 in a specified manner; a wafer introduction tank (delivery tank) 2 which is communicated with the wafer cleaning tank 1 and takes out the cleaned semiconductor wafer 6 from the inside of the wafer cleaning tank 1 to the outside; and a shutter mechanism 10 which opens/closes an opening 10b formed between the wafer cleaning tank 1 and the wafer introduction tank 2. An FFU (adhesion prevention mechanism) 15 provided on the top of the wafer introduction tank 2 is used to control an air current in the opening 10b. Thus, when the semiconductor wafer 6 is taken out from the wafer cleaning tank 1 to the wafer introduction tank 2 through the opening 10b after the cleaning process, a cleaning liquid which is used inside the wafer cleaning tank 1 is prevented from being attached to the semiconductor wafer 6. COPYRIGHT: (C)2007,JPO&INPIT
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