Monitoring method for production of linkage structures and contacts in a semiconductor component forms contact lead-throughs in a dielectric layer to link to a test surface

摘要

Several contact lead-throughs (110A,110B) are formed in a dielectric layer (103) so as to produce a connection with a test surface. A contact lead-through is created in a dielectric layer so as to produce an electric connection with a conductive region (102) formed in a semiconductor component. Test data is picked up from a test surface and its priorities are assessed. An independent claim is also included for a semiconductor structure.