| 摘要 |
A semiconductor module is provided to prevent the outer part of an FBGA package mounted on a PCB from being cracked by making a coupling axis support the FBGA . An upper solder joint pad(112) is formed at four corners of one side of a substrate(111) in an FBGA package(110). A lower solder joint pad(121) is formed in the same position as the upper solder joint pad in a PCB(120). The upper solder joint pad is connected to the lower solder joint pad to couple the FBGA package to the PCB, and a coupling axis(131) is formed by solder paste.
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