发明名称 ELECTRONIC COMPONENT ATTACHING EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To detect suction state of an electronic component by a suction nozzle by means of a detector before the electronic component is attached, and to collect an electronic component under poor suction state certainly by detecting the suction state again by means of the detector following to collecting operation. <P>SOLUTION: As shown on Fig. 4, electronic component attaching equipment 1 comprises an open/close valve 49B for switching between air supply from an air supply source and interruption of air supply, a valve 49A for switching interconnection with a vacuum source and the air supply source, an air switching valve provided in correspondence with each suction nozzle and interconnected with the open/close valve or the switching valve, a line sensor unit 37 for detecting suction state of each electronic component before it is attached, and a CPU 90 controlling each air switching valve to perform operation for collecting an electronic component under poor suction state detected by the sensor unit to a collection box and to detect an electronic component again by means of the sensor unit, and controlling all air switching valves to perform operation for collecting the electronic component to the collection box if the suction state detected again by the sensor unit is also poor. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007036162(A) 申请公布日期 2007.02.08
申请号 JP20050221637 申请日期 2005.07.29
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 KAMEDA MAKIO;URATA NAOKI;FUKUSHIMA YOSHIHARU
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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