| 发明名称 |
METHOD OF OVERMOLDING A SUBSTRATE FOR AN IMPLANTABLE MEDICAL DEVICE AND SUBSTRATE MADE BY THAT PROCESS |
| 摘要 |
<p>An overmolded substrate having a generally planar substrate with a plurality of support feet on the first side of the substrate. A molding material is molded around the substrate enveloping the substrate of both the first side and the second side of the substrate. The substrate may have a coil positioned on the second side of the magnetic substrate.</p> |
| 申请公布号 |
EP1744865(A1) |
申请公布日期 |
2007.01.24 |
| 申请号 |
EP20040785137 |
申请日期 |
2004.09.22 |
| 申请人 |
MEDTRONIC, INC. |
发明人 |
DEININGER, STEVE, T.;KAST, JOHN, E.;PETERS, CHARLES, E. |
| 分类号 |
B29C45/14;A61N1/375;B29C33/12;B29C45/16;B32B3/10 |
主分类号 |
B29C45/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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