| 摘要 |
An apparatus for cooling a PCB(Printed Circuit Board) is provided to improve a tension intensity of solder by cooling the solder with a cooling water. An apparatus for cooling a PCB includes a conveyer(10), a cooling unit(30), and a cleaning unit. The conveyer(10) conveys a PCB which is soldered in a separated solder tank. The cooling unit(30) having a nozzle(31) lowers a temperature of solder by spraying cooling water to the solder of the PCB conveyed from the conveyer(10). The cleaning unit cleans the cooling water remained on the PCB which passes thorough the cooling unit(30). The cooling unit(30) further includes a cooling brush which secondarily cools the solder of the PCB which passes through the nozzle.
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