发明名称 SURFACE PROCESSING METHOD, CAPACITOR STRUCTURE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface processing method capable of forming a rough surface at atom level, a capacitor structure capable of significantly improving capacity per a unit area, a manufacturing method thereof, and an electronic device. SOLUTION: A halogen radical (chlorine radical) is generated from a material (chlorine) containing halogen, near the surface of a porous film 110 which is formed on the surface of a silicon substrate 101 and comprises micropores at atom level. By making the halogen radical (chlorine radical) collide with the surface of the silicon substrate 101 through the micropores of the porous film 110, a rough surface 101a at atom level is formed on the silicon substrate 101. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007012708(A) 申请公布日期 2007.01.18
申请号 JP20050188667 申请日期 2005.06.28
申请人 ANGSTROM TECHNOLOGIES:KK 发明人 OBA YOSHIYUKI;SAKAMOTO HITOSHI
分类号 H01L21/822;H01L21/3065;H01L21/8246;H01L27/04;H01L27/105 主分类号 H01L21/822
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