发明名称 HEAT DISSIPATION SHEET AND HEAT DISSIPATION STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation sheet which is more preferably usable in the use of dissipating heat generated from a heat generating object, and a heat dissipation structure provided with the heat dissipation sheet. <P>SOLUTION: The heat dissipation structure 11 is provided with the heat dissipation sheet 21, a case 12 and the heat generating object 13. The heat dissipation sheet 21 is provided with a graphite sheet 22 and an elastic layer 23 having electric insulation to be provided on the surface 22a of thereof. The average thickness of the graphite sheet 22 is not more than 300μm. The elastic layer 23 is formed of an elastic composition containing a particle-like thermal conductive filler. The average thickness of the elastic layer 23 is 10-280μm. The average grain size of the thermal conductive filler is not more than 50% of the average thickness of the elastic layer 23. In the elastic composition, the content of the thermal conductive filler is not less than 30 vol.%, and the content of the thermal conductive filler having the average grain size of not less than 95% of the average thickness of the elastic layer 23 is less than 15 vol.%. The volume of a free space 12a in the case 12 is less than 20% of the capacity of the case 12. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007012913(A) 申请公布日期 2007.01.18
申请号 JP20050192438 申请日期 2005.06.30
申请人 POLYMATECH CO LTD;OTSUKA DENKI KK 发明人 OTA MITSURU;YAMAZAKI JUN;FUJIWARA KIKUO
分类号 H01L23/373;B32B9/00;H05K7/20 主分类号 H01L23/373
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