SEMICONDUCTOR CLEANING APPARATUS FOR CLEANING BACK SIDES OF SEMICONDUCTOR WAFERS

摘要

Semiconductor cleaning equipment for cleaning a back side of a semiconductor wafer is provided to prevent the damage of a front side of the wafer due to a contact by separating a center of the front side of the wafer from an upper side of a chuck. A process chamber(100) has an inner space. A plasma generating unit(140) generates plasma in the process chamber. A gas injection unit injects a cleaning gas into the process chamber. A chuck(110) is arranged in the process chamber. The chuck is loaded so that a back side of a wafer(W) faces upward. The back side of the wafer is cleaned by using the plasma cleaning gas. A center of a front side of the loaded wafer is separated from an upper surface of the chuck. A placing surface(112) where an edge of the front side of the wafer is placed is arranged on the upper surface of the chuck. The upper surface of the chuck located in the placing surface is separated from the center of the front side of the loaded wafer.