| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit substrate which can fully improve the heat dissipation of an electronic part to be mounted. SOLUTION: In a region in which a cover insulating layer 4 on a base insulation layer 2 is not formed, a plurality of pierced holes 6 are formed penetrating the face of the exposed adhesive layer 5 from the face of the exposed base insulation layer 2, each of four protrusions 21 of a metal stiffening plate 20 penetrate each of the plurality of pierced holes 6, and the wiring circuit substrate 100 is manufactured by sticking the metal stiffening plate 20 on the adhesive layer 5. An electronic part 10 is mounted on the wiring circuit substrate 100 by the terminal 11 which is composed of the solder of the electronic part 10 connected to a conductive pattern 3 that is exposed to the outside. In this case, the front end of the protrusion 21 of the metal stiffening plate 20 is contact with the electronic part 10. COPYRIGHT: (C)2007,JPO&INPIT
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