| 摘要 |
A semiconductor device is provided to sufficiently obtain a bonding region required for a bonding process by forming a measuring unit adjacent to a bonding pad for measuring a size and/or position of a probe mark. A bonding pad(120) is formed on at least one surface of a semiconductor chip(110). A measuring unit(150) is formed to be adjacent to the bonding pad. The measuring unit measures a size and/or position of a probe mark(130) formed on the bonding pad. The bonding pad is extended to a predetermined direction. The measuring unit includes at least one measuring height(150a). The measuring height is formed to be separated from a predetermined direction in parallel with the extended direction at a predetermined interval. The bonding pad includes a first protective layer pattern and a second protective layer pattern. The first protective layer pattern is formed on the semiconductor chip and exposes the bonding pad. The second protective layer pad is formed on the first protective layer, has a measuring height region, and exposes the bonding pad.
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