发明名称 |
Method of producing circuit component built-in module with embedded circuit component |
摘要 |
A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component package, and applying heat and pressure to embed the circuit component in the sheet-like member, and patterning the metal foil. The circuit component package includes a mounting member with substrate and wiring pattern and a circuit component. The circuit component includes a component body and external electrode, with the component body being thinner at a portion on which the external electrode is provided. The external electrode is provided on a surface of the circuit component that is opposed to the mounting member, and the component body is in contact with the mounting member. |
申请公布号 |
US7140104(B2) |
申请公布日期 |
2006.11.28 |
申请号 |
US20040902523 |
申请日期 |
2004.07.29 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HIRANO KOICHI;NAKATANI SEIICHI;HANDA HIROYUKI;YOSHIDA TSUNENORI;YAMASHITA YOSHIHISA;ISHITOMI HIROYUKI |
分类号 |
H01K3/10;H01G2/06;H01L25/065;H01L29/06;H05K1/18;H05K3/34 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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