| 摘要 |
PROBLEM TO BE SOLVED: To prevent a recording element substrate from being contaminated due to a scattering of an adhesive, when an electric wiring board is joined with a unit mounted with the recording element substrates. SOLUTION: An adhesive 105a is applied to a recording element unit 100 composed of a second plate 102 bonded to the surface of a first plate 101 and mounted with the recording element substrates 103 and 104, and the unit 100 is conveyed to a laminating device 6. Further, a suction finger 6a sucking the electric wiring board 105 is lowered to bring the electric wiring board 105 into contact with the recording element unit 100 for lamination. A gas such as a clean air is spewed from an oval hole 6c to the bottom of the suction finger 6a, and thus, a shielding wall A<SB>1</SB>as an air curtain is formed. Consequently, the scattering particle of the adhesive 105a can be prevented from sticking to the recording element substrates 103 and 104. COPYRIGHT: (C)2007,JPO&INPIT
|
