Integrated pressure and acceleration measurement device and a method of manufacture thereof

摘要

An integrated pressure and acceleration sensing device comprises three silicon wafers ( 101 - 103 ) bonded together by silicon fusion bonding. The wafers ( 101 - 103 ) are shaped so as to define a pressure sensitive element ( 113 ) and an acceleration sensing element ( 112 ). At least one stress measuring means linked to each of said pressure sensing and acceleration sensing elements ( 113,112 ) which are operable to generate a measurement signal responsive to deformation of said stress measuring means and which is indicative of the sensed values of pressure and/or acceleration. The device is manufactured by shaping said silicon wafers ( 101 - 103 ) define parts which act to form pressure and acceleration sensing elements ( 113,112 ) and bonding said silicon wafers ( 101 - 103 ) together using bonding techniques such as silicon fusion bonding, anodic bonding or glass-frit bonding. The wafers ( 101 - 103 ) are polished or lapped said to produce a relatively thin single integrated device.