| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an epoxy resin composition for sealing a semiconductor which perfectly eliminates the contact chance with moisture of kneaded matter or a ground product and extremely reduces trouble in a sheeting and cooling process, the epoxy resin composition for the semiconductor and an electronic component device using it. SOLUTION: The manufacturing method of the epoxy resin composition for sealing the semiconductor containing an epoxy resin, a curing agent and an inorganic filler has a process for mixing a raw material containing the epoxy resin, the curing agent and the inorganic filler and kneading the same in a kneader to obtain the kneaded matter, a process for rolling the kneaded matter into a sheetlike form by a rolling roll, a process for cooling the rolled material in a low temperature gas while feeding the same by a cooling conveyor, a process for grinding the rolled material by a grinder to obtain the ground product and a process for compression-molding the ground product. COPYRIGHT: (C)2007,JPO&INPIT |
