Plating solution, conductive material, and surface treatment method of conductive material

摘要

A plating solution including a copper salt, an organic phosphonic acid compound, and at least one compound or ions selected from an amine, alpha-amino acid, ammonium ions, carbonic acid ions, carboxylic acid ions, dicarboxylic acid ions, sulfuric acid ions, and thiosulfuric acid ions and a method of treating the surface of a conductive material using this plating solution.