| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress wearing of the holding surface of a holding tool, and to suppress adhesion of contamination to the holding surface. <P>SOLUTION: In a device for attaching an electronic component, the holding tool for holding an electronic component 91 comprises a cylindrical tool body, and a tool projection 335 that projects from the lower end of the tool body. The tip face of the tool projection 335 is a holding surface 3351 for sucking and holding the electronic component 91. In the outer periphery of the tip 3353 of the tool projection 335, a corner is removed by polishing and the contour of outer periphery swells outside to form a curve. The width of W of an R 3355 formed by removing the corner is 1/4 of the difference between the outside diameter and inside diameter of the tool projection 335. In the holding tool, since the displacement distribution of the holding surface 3351 has no inflection point when an ultrasonic vibration is applied, partial abrasion or conflicts are reduced between the holding surface 3351 and the electronic component 91, resulting in suppressing wear of he holding surface 3351 and adhesion contamination to the holding surface 3351. <P>COPYRIGHT: (C)2007,JPO&INPIT |
