| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method and a semiconductor module capable of increasing mounting density while securing high reliability. SOLUTION: The semiconductor device 70 is provided with a laminated semiconductor package 12 configured by laminating a plurality of individual semiconductor packages 13 where a semiconductor element 1 is fixed to a wiring member 4 comprising a flexible substrate 4a and wiring 4b, and a base substrate 5 on which the laminated semiconductor package 12 is mounted. For the individual semiconductor package 13, at least the wiring 4b of the wiring material 4 fixed to the semiconductor element 1 is connected to the base substrate 5 by extending the wiring from only one side of the semiconductor element 1. COPYRIGHT: (C)2007,JPO&INPIT |
