HIGH DENSITY INTERCONNECTION DEVICE WITH DIELECTRIC COATING
摘要
<p>A high-density interconnection device or connector (1) that is formed with wafer in a stacked arrangement. The stack of wafers (20) is arranged to include signal wafers (20b) that alternate with shield wafers (20a). A dielectric coating (40) is applied to at least one body surface of one or more of the wafer to prevent electrical bridging between the adjacent signal and shield wafers (20a, 20b), e.g. when conductive debris is lodged between the wafers (20).</p>
申请公布号
WO2006102121(A1)
申请公布日期
2006.09.28
申请号
WO2006US09795
申请日期
2006.03.17
申请人
INTERPLEX NAS, INC.;THOMAS, RALPH;FRECHETTE, RAYMOND, A.