| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive solder resist composition capable of providing a high performance cured film excellent in heat resistance, wet heat resistance, adhesion, mechanical characteristics and electrical properties, and suitable for use in manufacture of a printed wiring board, a high density multilayer plate, a semiconductor package, etc., and to provide a photosensitive solder resist film obtained by disposing a layer of the photosensitive solder resist composition on a support, and providing a cured film having excellent heat resistance, wet heat resistance, adhesion, mechanical characteristics and electrical properties, and to provide a photosensitive solder resist film optimum for a blue-violet laser direct exposure system. <P>SOLUTION: The photosensitive solder resist composition comprises an alkali-soluble photo-crosslinkable resin, an alkali-soluble elastomer, a polymerizable compound, a photopolymerization initiator, a thermal crosslinking agent, an inorganic filler, a colorant and a heat curing accelerator. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
