Overmolded electronic assembly with insert molded heat sinks

摘要

An overmolded electronic assembly (100) includes a substrate (104), a plurality of surface mount technology (SMT) integrated circuit (IC) chips (106), a plurality of heat sinks (114), a backplate (102) and an overmold material (120). The substrate (104) includes a plurality of conductive traces formed on a first surface of the substrate (104). The IC chips (106) each include an active front side and a backside and the IC chips (106) are electrically coupled to one or more of the traces. The heat sinks (114) are each in thermal contact with the backside of a different one of the IC chips (106) and are independent of each other. The backplate (102) is attached to a second surface of the substrate (104), which is opposite the first surface of the substrate (104). The overmold material (120) covers the first surface of the substrate (104) and maintains the heat sinks (114) in thermal contact with an associated one of the IC chips (106).