发明名称 Aspheric-surface processing method and aspheric-surface forming method
摘要 An aspheric-surface processing method according to the present invention, uses a cutting apparatus including at least one turning tool movable in the same direction as the rotating axis of the work and is also movable in a direction perpendicular to the rotating axis of the work. This method includes moving the turning tool at a predetermined feed pitch in a fixed direction over at least a part of the work region extending from the center of the rotating axis of the work to a peripheral portion of the work and also moving the turning tool in another direction perpendicular to the rotating axis of the work in order to process the work for forming an axis-asymmetric aspheric surface.
申请公布号 US7070474(B2) 申请公布日期 2006.07.04
申请号 US20040779867 申请日期 2004.02.18
申请人 SEIKO EPSON CORPORATION 发明人 MIYAZAWA MAKOTO
分类号 B23B5/00;B24B13/04;B24B13/06 主分类号 B23B5/00
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