| 摘要 |
<P>PROBLEM TO BE SOLVED: To electrically connect an electrode without using a wire and a bump, to efficiently emit and receive light, and to reduce cost in an optical semiconductor element, in an optical semiconductor device and a manufacturing method of the optical semiconductor element. <P>SOLUTION: The element includes an element main body 20 in an almost rectangular shape where a p-type semiconductor layer 15 and an n-type semiconductor layer 16 are laminated, and an n-type corner electrode 18 which is formed in a region where at least one of corners of the element main body 20 is chamfered and which electrically conducts the n-type semiconductor layer 16 in an insulated state with the other layer. Thus, an n-side wiring pattern 13B and the n-type corner electrode 18 on a substrate 14 are bonded by a conductive adhesive such as solder paste and Ag paste and they are conducted. Thus, a sealing resin 6 can be suppressed to be low at the time of packaging and interruption of light by the wire is eliminated. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
