发明名称 Multi-tier keypad assembly
摘要 A multi-tier keypad includes at least a first circuit board having a first circuit and a second circuit board having a second circuit, wherein the second circuit board is disposed adjacent to the first circuit board, one or more first key assemblies for providing input to the first circuit when a first key assembly is pressed and one or more second key assemblies for providing input to the second circuit when a second key assembly is pressed. Apertures are formed through the first circuit board. These apertures allow the second key assemblies to extend through the first circuit board for providing input to the second circuit.
申请公布号 US7067757(B1) 申请公布日期 2006.06.27
申请号 US20040015086 申请日期 2004.12.17
申请人 SIEMENS COMMUNICATIONS INC. 发明人 CHADHA LOVLEEN
分类号 H01H1/10 主分类号 H01H1/10
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