发明名称 HEAT-PEELABLE SELF-ADHESIVE SHEET, AND ELECTRONIC PART AND CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a heat-peelable self-adhesive sheet which has a suitable adhesive force for conveying goods or for fixation at the time of processing, can be peeled off by reducing its adhesive force by heating after the accomplishment of the purpose, and can effectively retain the state of the reduced adhesive force. SOLUTION: The heat-peelable self-adhesive sheet comprises a substrate and, formed on at least one surface thereof, a heat-expandable self-adhesive layer containing a blowing agent and can retain the adhesive force of the heat-expandable self-adhesive layer at the magnitude of at most 10% of the adhesive force before the heat treatment even when it is kept in a state where the adhesive force of the heat-expandable adhesive layer is reduced by heating to a level as low as at most 10% of the adhesive force before the heat treatment and then further heated and kept under heating for at least 30 min at a temperature higher by at least 30°C than the peeling initiation temperature of the heat expandable self-adhesive layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006160872(A) 申请公布日期 2006.06.22
申请号 JP20040353831 申请日期 2004.12.07
申请人 NITTO DENKO CORP 发明人 DOI TOMOKO;MURATA AKIHISA;ARIMITSU YUKIO;SATO MASAAKI
分类号 C09J7/02;C09J5/08;C09J9/00;C09J11/00;C09J201/00;H05K3/00 主分类号 C09J7/02
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