| 摘要 |
Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.
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