| 发明名称 |
Systems and slurries for chemical mechanical polishing |
| 摘要 |
Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface.
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| 申请公布号 |
US7052373(B1) |
申请公布日期 |
2006.05.30 |
| 申请号 |
US20050038514 |
申请日期 |
2005.01.19 |
| 申请人 |
ANJI MICROELECTRONICS CO., LTD. |
发明人 |
YANG ANDY CHUNXIAO;YU CHRIS CHANG |
| 分类号 |
B24B1/00 |
主分类号 |
B24B1/00 |
| 代理机构 |
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