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发明名称
SILICON DIRECT BONDING METHOD
摘要
申请公布号
KR100571848(B1)
申请公布日期
2006.04.11
申请号
KR20050000831
申请日期
2005.01.05
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LIM, SEUNG MO;LEE, HWA SUN;LEE, JAE CHANG;CHUNG, JAE WOO;KIM, WOON BAE
分类号
H01L21/20
主分类号
H01L21/20
代理机构
代理人
主权项
地址
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