| 发明名称 |
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS |
| 摘要 |
<p>In a grooving process and a cutting process of a semiconductor material and a ceramics material by using laser beams, processing performance is improved. A laser processing method and a laser processing apparatus are provided for performing a grooving process or a cutting process by pulse-irradiating an inorganic object (2) to be processed with ultraviolet laser beams (?<sup</p> |
| 申请公布号 |
WO2006035870(A1) |
申请公布日期 |
2006.04.06 |
| 申请号 |
WO2005JP17943 |
申请日期 |
2005.09.29 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION;KATO, HIROKAZU;HIGANO, SATORU |
发明人 |
KATO, HIROKAZU;HIGANO, SATORU |
| 分类号 |
B23K26/40;B23K101/40;B28D5/00 |
主分类号 |
B23K26/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
