METHOD FOR MANUFACTURING CHIP SIZE PACKAGE IMPROVING SOLDER JOINT CHARACTERISTIC

摘要

PURPOSE: A method for manufacturing a chip size package(CSP) is provided to reduce manufacturing cost without performing an under bump metal(UBM) process, and to prevent reliability of a solder joint part from being decreased by thermal stress by improving the solder joint characteristic. CONSTITUTION: A convexo-concave structure is formed on a chip pad(2) including a plurality of chip pads. A photosensitive material is coated on a chip(1) having the convexo-concave structure. The surface of the chip coated with the photosensitive material is polished to make the photosensitive material and an end portion of the convexo-concave structure become horizontal. Masks are disposed on the surface-polished chip and light is irradiated. The photosensitive material is developed to expose the convexo-concave structure formed on the chip pad. Flux is printed on the chip pad opened by exposing the convexo-concave structure. A solder ball(8) is mounted on the flux and reflowed to adhere the solder ball to an upper surface of the chip pad.