发明名称 Methods and apparatus for thermally coupling a heat sink to a circuit board component
摘要 A heat sink has a flexure member attached to a base of the heat sink and located between the base and an associated circuit board component. As the heat sink attaches to a circuit board carrying the circuit board component, the flexure member conforms to the surface of the circuit board component, thereby thermally contacting the circuit board component. The flexure member absorbs local tolerance differences on the circuit board component to provide a relatively uniform stress across the surface of the circuit board component. The flexure member further limits the amount of stress generated by the heat sink on the circuit board component. When used in conjunction with a heat sink spanning several circuit board components, the flexure member absorbs global tolerance differences among the circuit board components, thereby providing relatively uniform stresses to all of the circuit board components and limiting the amount of stress experienced by any one circuit board component.
申请公布号 US7019976(B1) 申请公布日期 2006.03.28
申请号 US20030454705 申请日期 2003.06.04
申请人 CISCO TECHNOLOGY, INC. 发明人 AHMAD MUDASIR;HUBBARD KENNETH
分类号 H05K7/20 主分类号 H05K7/20
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