| 摘要 |
PROBLEM TO BE SOLVED: To enable elements different in shape from each other composed of fine structure like MEMS to be monolithically mounted on a semiconductor substrate on which LSI and the like are formed. SOLUTION: The switch structure is composed of a spring beam 107 connected to the side part of a flat movable electrode 105, anchors 108 fixing the spring beam on an interlayer insulation layer 102, a contact electrode 109 fixed on a lower face of the flat movable electrode 105, a driving electrode part 110 arranged on the interlayer insulation layer 102, a signal wiring part 111, side wall frame works 103 surrounding the switch structure, a ceiling wall 104 arranged on the side wall frame works, and a container enveloping the switch structure. COPYRIGHT: (C)2006,JPO&NCIPI
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