| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method of a semiconductor substrate which does not make metal wiring be eluted without generating a spot on the surface of a semiconductor substrate, and to provide a semiconductor substrate processing device used for such cleaning. SOLUTION: A semiconductor processing device 1 comprises a rinse room 2 for accommodating a semiconductor substrate 3 and for rinsing the semiconductor substrate 3. The rinse room 2 is connected with piping 5 for supplying washings to the semiconductor substrate 3. In the middle of the piping 5 for supplying washings, a gas dissolver 4 is formed so as to dissolve predetermined gas into ultrapure water. As the predetermined gas, inert gas or reducing gas is dissolved into ultrapure water. A control unit 6 is formed for possessing a function to supply the washings wherein the predetermined gas is dissolved before performing drying processing to the rinsed semiconductor substrate 3. COPYRIGHT: (C)2006,JPO&NCIPI
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