| 摘要 |
<p>The invention concerns a method for treating electronic components made of copper, nickel or alloys thereof or with materials such as brass or plated therewith. The inventive method comprises the following steps which consist in: arranging the components in a treatment chamber, generating a vacuum in the treatment chamber, introducing oxygen into the treatment chamber, providing a pressure ranging between 10-1 and 50 mbar in the treatment chamber and exciting a plasma in the chamber by means of a high frequency generator having a frequency higher than about 1 MHz, allowing the oxygen radicals to act on the components, the flow of the radicals on the surface of the components being more than 1021 radicals per square meter per second approximately, generating a vacuum in the treatment chamber, introducing hydrogen into the treatment chamber, providing a pressure ranging between 10-1 and 50 mbar in the treatment chamber and exciting a plasma in the chamber by means of a high frequency generator having a frequency higher than about 1 MHz, and allowing the hydrogen radicals to act on the components, the flow of the radicals on the surface of the components being higher than 1021 radicals per square meter per second approximately.</p> |
