发明名称 AUTOMATIC ELECTRONIC COMPONENT MOUNTING DEVICE, ELECTRONIC COMPONENT SUPPLY DEVICE, ELECTRONIC COMPONENT SEQUENCER DEVICE, AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 An automatic electronic component mounting device (1) for mounting electronic components onto a printed wiring board (10), comprising a component mounting head (4) moving along the X-axis direction and sucking an electronic component to mount it on the printed wiring board (10), a table (8) for moving the printed wiring board along the Y-axis direction, electronic component supply devices (12, 14) attached to this table (8) and moving concurrently with the printed wiring board, and a component image recognizing/correcting means (16) for image-recognizing the attitude of an electronic component during a period from the sucking of an electronic component by the component mounting head to the mounting and correcting the attitude, the device being so constructed as to allow the sucking position and mounting position of an electronic component and the image recognition position of an electronic component to be located on the X-axis. Also, electronic component supply devices of square-pipe type and plate type are disclosed.
申请公布号 KR20060002859(A) 申请公布日期 2006.01.09
申请号 KR20057017910 申请日期 2005.09.23
申请人 POPMAN CORPORATION 发明人 SHIMADA KATSUMI
分类号 H05K13/04;H05K13/02 主分类号 H05K13/04
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