| 摘要 |
PROBLEM TO BE SOLVED: To enable mounting of a semiconductor device on a printed circuit board in a simple and convenient manner, by optimizing the amount of resin provided on the bump electrode surface of the semiconductor device. SOLUTION: The semiconductor device comprises a substrate 1 having a plurality of wiring lines provided thereon, a semiconductor element 2 mounted on the substrate 1 and having wiring pads, a connecting means 3 for electrically connecting the plurality of wiring lines of the substrate 1 to the wiring pads of the semiconductor element 2, a plurality of bump electrodes 4 provided on the side of the substrate 1 opposed to the semiconductor element 2, and a resin 5 provided on the substrate between the plurality of bump electrodes 4. The surface area of the lower surface of the substrate provided with the resin 5 is equal to or larger than the surface area of the substrate. Consequently, an optimum amount of resin can be provided, and this can contribute largely to an increased reliability, since the shape of the resin forms a large fillet after a printed circuit board is mounted. COPYRIGHT: (C)2006,JPO&NCIPI
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