发明名称 HIGH DIELECTRIC CONSTANT INSULATING FILM, THIN-FILM CAPACITIVE ELEMENT, THIN-FILM MULTILAYER CAPACITOR, AND METHOD FOR MANUFACTURING THIN-FILM CAPACITIVE ELEMENT
摘要 <p>A dielectric thin film 8, comprising a first bismuth layer-structured compound layer 8a expressed by a composition formula of (Bi2O2)<2+>(Am-1 Bm O3m+1)<2-> or Bi2 Am-1 Bm O3m+3, wherein "m" is a positive number, "A" is at least one element selected from Na, K, Pb, Ba, Sr, Ca and Bi, and "B" is at least one element selected from Fe, Co, Cr, Ga, Ti, Nb, Ta, Sb, V, Mo and W. Between the first bismuth layer-structured compound layer 8a and a lower portion electrode 6, a second bismuth layer-structured compound layer 8b including bismuth in excess of that in the composition formula of said first bismuth layer-structured compound layer 8a. <IMAGE></p>
申请公布号 EP1598872(A1) 申请公布日期 2005.11.23
申请号 EP20040713996 申请日期 2004.02.24
申请人 TDK CORPORATION 发明人 MIYAMOTO, YUKI;SAKASHITA, YUKIO
分类号 C01G29/00;C04B35/475;H01G4/12;H01G4/30;H01L21/02;(IPC1-7):H01L27/04;H01L27/10;H01G4/33;C04B35/453 主分类号 C01G29/00
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