| 摘要 |
An electrical test device, in particular for testing wafers, having a contact head, which is associated with the test object and is provided with pin-shaped contact elements that are arrayed to form a contact pin arrangement. An electrical connection apparatus, including contact faces which are in touching contact with ends of the contact elements which face away from the test object. A centering device, which permits only radial play for thermal expansion by sliding guides, for centrally aligning the contact head and the connection apparatus with respect to one another.
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