PREPREG, METAL FOIL CLAD LAMINATE AND PRINTED CIRCUIT BOARD OBTAINED USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a metal foil-clad laminate and a printed-circuit board attaining both bond strength between a metal foil and a substrate and heat resistance on sufficiently high levels and prepreg to provide them. SOLUTION: The prepreg 100 is obtained by removing a solvent from a varnish that comprises the solvent and a polyamide-imide resin dissolved in the solvent and is impregnated into a fiber substrate. The solvent is a mixed solvent composed of a good solvent and a poor solvent for the polyamide-imide resin. COPYRIGHT: (C)2006,JPO&NCIPI