发明名称 COOLING DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To constitute a large-sized heat sink by suppressing deformation of fins. SOLUTION: A cooling device 1 is constituted of a heat sink 2 which arranges side by side a first heat sink 2a and a second heatsink 2b laminating two or more sheets of fins 6 with spacing. Heat pipes 4a-4c are connected to the first heat sink 2a, and a heat pipes 5a-5c are connected to the second heat sink 2b. Each heat pipes 4a-4c and 5a-5c are connected to a heat receiving material 3. The heat transmitted to the heat-receiving material 3 is transmitted to the first heat sink 2a and the second heat sink 2b, respectively. Further, the cooling device has a framework 7 supported by the heat pipes 4a-4c and 5a-5c. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005322757(A) 申请公布日期 2005.11.17
申请号 JP20040139134 申请日期 2004.05.07
申请人 SONY CORP 发明人 AMANO KOTARO
分类号 F28D15/02;H01L23/427;H05K7/20;(IPC1-7):H01L23/427 主分类号 F28D15/02
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