发明名称 |
Polishing apparatus |
摘要 |
A polishing surface is conditioned by pressing a diamond dresser against the polishing surface to thinly shave a surface of the polishing surface. Foreign matter clogging concavities formed in the polishing surface is scraped by pressing a brush dresser against the polishing surface in a state such that a polishing liquid is not supplied to the polishing table. A liquid composed of a mixture of a liquid or inert gas with pure water or a chemical liquid is ejected onto the polishing surface to clean the polishing surface. |
申请公布号 |
US6953390(B2) |
申请公布日期 |
2005.10.11 |
申请号 |
US20030342253 |
申请日期 |
2003.01.15 |
申请人 |
EBARA CORPORATION |
发明人 |
SAKURAI KUNIHIKO;YOSHIDA HIROSHI;TOGAWA TETSUJI |
分类号 |
B08B3/10;B08B3/12;B24B37/00;B24B37/04;B24B53/007;B24B53/013;B24B53/017;B24B53/02;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B08B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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