发明名称 Polishing apparatus
摘要 A polishing surface is conditioned by pressing a diamond dresser against the polishing surface to thinly shave a surface of the polishing surface. Foreign matter clogging concavities formed in the polishing surface is scraped by pressing a brush dresser against the polishing surface in a state such that a polishing liquid is not supplied to the polishing table. A liquid composed of a mixture of a liquid or inert gas with pure water or a chemical liquid is ejected onto the polishing surface to clean the polishing surface.
申请公布号 US6953390(B2) 申请公布日期 2005.10.11
申请号 US20030342253 申请日期 2003.01.15
申请人 EBARA CORPORATION 发明人 SAKURAI KUNIHIKO;YOSHIDA HIROSHI;TOGAWA TETSUJI
分类号 B08B3/10;B08B3/12;B24B37/00;B24B37/04;B24B53/007;B24B53/013;B24B53/017;B24B53/02;H01L21/304;(IPC1-7):B24B1/00 主分类号 B08B3/10
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