发明名称 Semiconductor device and manufacturing method thereof
摘要 An MIM capacitor using a high-permittivity dielectric film such as tantalum oxide. The MIM capacitor includes an upper electrode, a dielectric film, and a lower electrode. A second dielectric film and the dielectric film are formed between the upper electrode and the lower electrode, at the end of the MIM capacitor. The second dielectric film is formed to have an opening at the top of the lower electrode. The dielectric film abuts the lower electrode via the opening. The upper electrode is formed on the dielectric film. The upper electrode and the dielectric film are formed in such a manner as to embrace the opening entirely, and the second dielectric film and the lower electrode are formed so that the respective widths are the same as, or greater than, the widths of the upper electrode and the dielectric film.
申请公布号 US2005212082(A1) 申请公布日期 2005.09.29
申请号 US20050059651 申请日期 2005.02.17
申请人 TAKEDA KENICHI;FUJIWARA TSUYOSHI;IMAI TOSHINORI;ISHIKAWA TSUYOSHI;MINE TOSHIYUKI;MIURA MAKOTO 发明人 TAKEDA KENICHI;FUJIWARA TSUYOSHI;IMAI TOSHINORI;ISHIKAWA TSUYOSHI;MINE TOSHIYUKI;MIURA MAKOTO
分类号 H01L21/02;H01L21/768;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L21/02
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