发明名称 METHOD FOR FORMING GATE ELECTRODE MADE OF DOPED SILICON FILM, AND METHOD FOR MANUFACTURING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a formation method of a gate electrode that does not require a large-scale device, is superior in the utilization ratio of raw materials and handling, and can reduce wastes, and to provide a manufacturing method of a device. <P>SOLUTION: In the method for forming the gate electrode containing the doped silicon film, a process for forming the doped silicon film provides a method for forming the gate electrode, including a process for coating the upper portion of the substrate with at least a liquid silicon material. In the method for manufacturing the device, the formation method of the gate electrode is used. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005228793(A) 申请公布日期 2005.08.25
申请号 JP20040033419 申请日期 2004.02.10
申请人 SEIKO EPSON CORP 发明人 AOKI TAKASHI
分类号 H01L21/28;H01L21/288;H01L21/336;H01L29/423;H01L29/49;H01L29/786 主分类号 H01L21/28
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