| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an efficient and highly accurate method and an apparatus for inspecting substrates capable of improving inspection accuracy while shortening the time required for inspection. <P>SOLUTION: In substrate inspections, images of inspection points of the mounting locations of parts, circuit patterns, etc. arranged on substrates are acquired by scanning with a scanning type sensor to inspect the location of each inspection point. By measuring the location of each base mark on the substrate in each substrate, the amount of locational displacement of the substrate itself is computed. By relating data on the reference locations of adjacent marks arranged adjacently to the inspection points on the substrate to computation results, the locations of the adjacent marks and the inspection points are measured with high locational accuracy. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
