发明名称 Plating bath and method for depositing a metal layer on a substrate
摘要 A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
申请公布号 US2005155866(A1) 申请公布日期 2005.07.21
申请号 US20030720972 申请日期 2003.11.24
申请人 SHIPLEY COMPANY, L.L.C. 发明人 GABE DAVID R.;COBLEY ANDREW J.;BARSTAD LEON R.;KAPECKAS MARK J.;REDDINGTON ERIK;SONNENBERG WADE;BUCKLEY THOMAS
分类号 C25D3/02;C25D3/38;C25D17/10;H05K3/24;(IPC1-7):C25D3/38 主分类号 C25D3/02
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