SPACE-EFFICIENT PACKAGE FOR LATERALLY CONDUCTING DEVICE

摘要

Efficient utilization of space in a laterally-conducting semiconductor device package (300) is enhanced by creating at least one supplemental downbond pad portion (311) of the diepad (308) for receiving the downbond wire (312) from the ground contact (314) of the device. The supplemental diepad portion (311) may occupy area at the end or side of the package formerly occupied by non-integral leads (306d-h). By receiving the substrate downbond wire, the supplemental diepad portion allows a greater area of the main diepad to be occupied by a die (302) having a larger area, thereby enhancing space efficiency of the package.